PCB n'elu ọgwụgwọ bụ isi na ntọala nke SMT patch àgwà.Usoro ọgwụgwọ nke njikọ a gụnyere isi ihe ndị a.Taa, m ga-eso gị kerịta ahụmịhe ahụ n'ime nyocha bọọdụ ndị ọkachamara:
(1) Ewezuga ENG, a naghị akọwapụta nke ọma na ọkpụrụkpụ nke oyi akwa na ụkpụrụ mba dị mkpa nke PC.A na-achọrọ naanị iji mezuo ihe achọrọ solderability.Ihe ndị a chọrọ n'ozuzu nke ụlọ ọrụ bụ ndị a.
OSP: 0.15 ~ 0.5 μm, akọwaghị ya site na IPC.Akwadoro iji 0.3 ~ 0.4um
EING: Ni-3～5um;Au-0.05 ~ 0.20um (PC na-akọwa naanị ihe achọrọ kacha mkpa ugbu a)
Im-Ag: 0.05 ~ 0.20um, na thicker, na-esiwanye ike na corrosion bụ (PC akọwapụtaghị)
Im-Sn: ≥0.08um.Ihe kpatara oke bụ na Sn na Cu ga-aga n'ihu na-etolite n'ime CuSn na ọnụ ụlọ okpomọkụ, nke na-emetụta solderability.
HASL Sn63Pb37 na-etolitekarị n'etiti 1 na 25um.O siri ike ịchịkwa usoro ahụ nke ọma.Enweghị ndu na-ejikarị SnCu alloy.N'ihi ogo nhazi dị elu, ọ dị mfe ịmepụta Cu3Sn na enweghị ụda ụda na-adịghị mma, ma ọ naghị eji ya ugbu a.
(2) The wettability ka SAC387 (dị ka wetting oge n'okpuru dị iche iche kpo oku ugboro, unit: s).
0 ugboro: im-sn (2) florida ịka nká (1.2), osp (1.2) im-ag (3).
Zweiter PLENAR SESSION Zweiter PLENAR SESSION Im-Sn nwere nguzogide corrosion kacha mma, mana nguzogide ire ere adịghị oke njọ!
4 ugboro: ENG (3) -ImAg (4.3) -OSP (10) -ImSn (10).
(3) The wettability ka SAC305 (mgbe ọ gafere n'ọkụ ugboro abụọ).
ENG (5.1)—Im-Ag (4.5)—Im-Sn (1.5)—OSP (0.3).
N'ezie, ndị na-amu amu nwere ike inwe mgbagwoju anya na paramita ọkachamara ndị a, mana ndị na-emepụta PCB proofing na patching ga-ahụrịrị ya.
Oge nzipu: Mee-28-2021
