Nkọwapụta | |
Njirimara | Uru |
Onye nrụpụta: | Winbond |
Otu ngwaahịa: | Ọ BỤGHỊ Flash |
RoHS: | Nkọwa |
Ụdị nrịgo: | SMD/SMT |
Ngwungwu / Akpa: | SOIC-8 |
Usoro: | W25Q64JV |
Nha ebe nchekwa: | 64Mbit |
Voltaji Na-eweta - Nkeji: | 2.7 V |
Voltaji na-eweta - Nke kachasị: | 3.6 V |
Ọgụgụ na-arụsi ọrụ ike ugbu a - Nke kachasị: | 25 mA |
Ụdị ihu: | SPI |
Ugboro elekere kacha elu: | 133 MHz |
Nhazi: | 8 nx8 |
Ogologo ụgbọ ala data: | 8 bit |
Ụdị oge: | Mmekọrịta |
Okpomọkụ arụ ọrụ kacha nta: | - 40 C |
Okpomọkụ arụ ọrụ kacha: | + 85 C |
Nkwakọ ngwaahịa: | Tray |
Akara: | Winbond |
Nbunye ugbu a - Nke kachasị: | 25 mA |
Mmiri nwere mmetụta: | Ee |
Ụdị ngwaahịa: | Ọ BỤGHỊ Flash |
Ọnụọgụ ngwugwu ụlọ ọrụ: | 630 |
ngalaba: | Ebe nchekwa & Nchekwa data |
Aha ahia: | SpiFlash |
Ibu nkeji: | 0,006349 oz |
atụmatụ:
* Ezinụlọ ọhụrụ nke ncheta SpiFlash - W25Q64JV: 64M-bit / 8M-byte
– SPI ọkọlọtọ: CLK, /CS, DI, DO
- Abụọ SPI: CLK, /CS, IO0, IO1
- Quad SPI: CLK, / CS, IO0, IO1, IO2, IO3 - Software & Ngwa nrụpụta (1)
* Oghere Usoro Flash kacha arụ ọrụ
- 133MHz Single, Dual/Quad SPI clocks
266/532MHz dakọtara Dual/Quad SPI
– Min.Mmemme 100K-Echicha okirikiri n'otu ngalaba - Ihe karịrị njigide data afọ 20
* “Na-agụ na-aga n'ihu” nke ọma
- Na-aga n'ihu na 8/16/32/64-Byte Kechie - Ihe dị ka elekere asatọ iji lebara ebe nchekwa anya.
- Na-enye ohere ọrụ ezi XIP (na-arụ ọrụ n'ebe) - na-arụ ọrụ X16 Parallel Flash
* Ike dị ala, oke okpomoku obosara - Naanị 2.7 ruo 3.6V ọkọnọ
- <1μA ike gbadata (ụdị)
-40C ruo +85°C nso ọrụ
* Architecture na-agbanwe agbanwe nwere ngalaba 4KB
- Ngalaba Uniform / Mgbochi mkpochapụ (4K / 32K / 64K-Byte) - Mmemme 1 ruo 256 byte kwa ibe mmemme - Nkwụsịtụ / Mmemme kwụsịtụrụ & maliteghachi
* Atụmatụ nchekwa dị elu
– Software na ngwaike Dee-Chebe
- Nchekwa OTP pụrụ iche (1)
- N'elu / N'okpuru, Mmeju n'usoro nchebe - Nchekwa n'otu n'otu / ngalaba array
- NJ pụrụ iche 64-Bit maka ngwaọrụ ọ bụla
- Ndebanye aha nke ihe ndị a na-achọpụta (SFDP) - 3X256-Bytes ndekọ nchekwa
- Mpempe akwụkwọ ndebanye aha na-adịghị agbanwe agbanwe
* Nkwakọ ngwaahịa dị mma nke oghere
- 8-pin SOIC 208-mil / VSOP 208-mil
- 8-pad WSON 6x5-mm/8x6-mm, XSON 4x4-mm - 16-pin SOIC 300-mil
- 8-pin PDIP 300-mil
- TFBGA 24-bọọlụ 8x6-mm (6x4 bọọlụ n'usoro)
- TFBGA 24-bọọlụ 8x6-mm (6x4/5x5 bọọlụ n'usoro)
- Kpọtụrụ Winbond maka KGD na nhọrọ ndị ọzọ